ACF-LM-01 is a Ring Setting (Riveting) Machine — PCB production equipment for the inner layer processing process within lamination and multilayer pcb equipment. It is built for process stability, throughput and operator safety on the factory floor.
Ring Setting (Riveting) Machine (ACF-LM-01)
Where the Ring Setting (Riveting) Machine Fits in PCB Manufacturing
In a PCB production line, the Ring Setting (Riveting) Machine operates in the inner layer processing area of lamination and multilayer pcb equipment. Correct integration with the upstream and downstream stages is essential to overall yield, cycle time and cost per panel.
Stainless-steel wetted parts and chemically resistant construction where the process requires it.
Safety interlocks, alarms and guarding designed for a production environment.
Designed for low maintenance, fast changeover and high equipment uptime.
Programmable temperature and pressure profiles for void-free lamination.
Vacuum lamination for resin flow control on multilayer stacks.
Typical Applications
Used to bond inner layers into multilayer and HDI stacks for telecom, computing and automotive boards.
Integration and Configuration
The Ring Setting (Riveting) Machine can be supplied as a standalone unit or integrated into a conveyorized, automated line. Panel-size handling, control software, throughput and material compatibility are configured to match your production mix. Because this is a configured-to-order system, the specification is finalized with our engineers before quotation.
Pricing
The Ring Setting (Riveting) Machine is a non-standard, configured-to-order system. Pricing starts from approximately US$52,000 for a base configuration and is finalized by quotation based on your panel size, automation level and throughput requirements.
Request a Quotation for the Ring Setting (Riveting) Machine
Tell us your requirements for the Ring Setting (Riveting) Machine (ACF-LM-01) and our engineers will respond within one business day with a tailored configuration and price.
Frequently Asked Questions
What is the Ring Setting (Riveting) Machine used for?
The Ring Setting (Riveting) Machine is used in the lamination and multilayer pcb equipment stage of PCB manufacturing, specifically for inner layer processing. It is designed for consistent, production-grade results.
Which board types does the Ring Setting (Riveting) Machine support?
It supports Rigid, multilayer, HDI (flex / rigid-flex optional). The exact configuration can be tailored to your product mix.
What is the maximum panel size for the Ring Setting (Riveting) Machine?
The standard maximum panel size is 610 x 610 mm. Larger or custom panel handling can be quoted on request.
Is the Ring Setting (Riveting) Machine automated?
It is supplied as semi-automatic. It can be operated standalone or integrated into a conveyorized line with upstream and downstream handling.
What throughput can the Ring Setting (Riveting) Machine achieve?
Typical throughput is 30-60 panels/hour, depending on panel size, recipe and board complexity.
How is the Ring Setting (Riveting) Machine controlled?
The Ring Setting (Riveting) Machine uses a plc + hmi touchscreen for recipe management, process monitoring and data logging.
How do I request a quotation for the Ring Setting (Riveting) Machine?
Use the equipment finder on this page to confirm your process stage, board type and throughput, then submit the inquiry form. An engineer from acfindustry.com will respond within one business day.
Accessories & Consumables
Compatible consumables and spare parts commonly supplied with lamination and multilayer pcb equipment. Contact us to add any of these to your equipment quotation.
