PCB Process Guides
In-depth guides to each stage of PCB manufacturing — etching, laser drilling, plating, AOI inspection, HDI and surface finishing — and the equipment behind them.
PCB Etching
Etching removes unwanted copper to define the circuit pattern. Controlling etch factor, uniformity and line width is what separates a usable board from scrap,…
Read guide →Laser Drilling and Via Formation
As designs shrink, microvias formed by UV and CO2 lasers replace mechanical drilling for the smallest holes. Via formation directly limits routing density and…
Read guide →PCB Plating and Metallization
Plating builds the conductive copper in holes and on the surface. Throwing power, thickness distribution and bath control determine whether vias are reliably filled…
Read guide →AOI and PCB Inspection
Inspection catches defects before they reach the customer. The right mix of optical inspection, electrical test and X-ray depends on board complexity and production…
Read guide →HDI PCB Manufacturing
High-density interconnect (HDI) boards use microvias, thin dielectrics and fine lines to pack more routing into less area. They demand laser drilling, fine-line imaging…
Read guide →Solder Mask and Surface Finish
Solder mask protects the copper and defines solderable areas; the surface finish preserves solderability and bondability. Together they set the board's assembly yield and…
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