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Process Guides

Laser Drilling and Via Formation for HDI PCBs

As designs shrink, microvias formed by UV and CO2 lasers replace mechanical drilling for the smallest holes. Via formation directly limits routing density and interconnect reliability.

Overview

Understanding laser drilling and via formation means understanding both the process chemistry/mechanics and the machines that control it. Here is what matters. Mechanical CNC drilling handles through-holes from about 0.10 mm upward; UV and CO2 laser systems form blind microvias well below that, which is essential for HDI any-layer stack-ups. After drilling, desmear and hole-wall treatment prepare the barrel for plating.

Where It Fits in the Process

Via formation sits between inner-layer lamination and plating/metallization. Clean, well-prepared holes are a precondition for reliable electroless copper and electroplating.

Equipment Categories Involved

Key Considerations

Hole-wall quality, aspect ratio and registration accuracy drive plating reliability; desmear and plasma cleaning are not optional for high-reliability boards.

Standards and Compliance

Designs and processes in this area commonly reference:

  • IPC-6016 (HDI)
  • IPC-4761 (via protection)
  • IPC-A-600

Selection and Comparison

Key trade-offs when specifying for laser drilling and via formation:

  • Mechanical CNC vs. laser drilling
  • UV vs. CO2 laser microvias
  • Desmear: chemical vs. plasma

Recommended Equipment from acfindustry.com

The following machines from our catalog support the processes discussed above:

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Frequently Asked Questions

What is Laser Drilling and Via Formation?

Mechanical CNC drilling handles through-holes from about 0.10 mm upward; UV and CO2 laser systems form blind microvias well below that, which is essential for HDI any-layer stack-ups. After drilling, desmear and hole-wall treatment prepare the barrel for plating.

What should I consider for laser drilling and via formation?

Hole-wall quality, aspect ratio and registration accuracy drive plating reliability; desmear and plasma cleaning are not optional for high-reliability boards.

What equipment is used for laser drilling and via formation?

It involves Drilling and Via Formation Equipment. You can browse each category and request a matched configuration through the equipment finder.

Where does laser drilling and via formation fit in the PCB process?

Via formation sits between inner-layer lamination and plating/metallization. Clean, well-prepared holes are a precondition for reliable electroless copper and electroplating.

Which standards apply to laser drilling and via formation?

Relevant standards include IPC-6016 (HDI), IPC-4761 (via protection), and IPC-A-600.

How do I get a quotation for laser drilling and via formation equipment?

Use the equipment finder on this page to specify your process stage, board type, automation level and production volume, then submit the inquiry. An engineer from acfindustry.com will respond within one business day.