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Process Guides

Solder Mask and Surface Finishing Equipment

Solder mask protects the copper and defines solderable areas; the surface finish preserves solderability and bondability. Together they set the board's assembly yield and shelf life.

Overview

Below we cover how solder mask and surface finish works, where it sits in the process flow, the standards that apply, and the equipment that performs it. Liquid photoimageable solder mask is coated, exposed, developed and thermally cured; legend (silkscreen or inkjet) adds markings. The final finish—HASL, lead-free HASL, ENIG, OSP, immersion tin or silver—protects exposed pads.

Where It Fits in the Process

Solder mask and finish are among the last fabrication steps before profiling, electrical test and shipment.

Equipment Categories Involved

Key Considerations

ENIG offers a flat, durable finish for fine-pitch; OSP is low-cost but has a shorter shelf life; HASL is robust but less flat.

Standards and Compliance

Designs and processes in this area commonly reference:

  • IPC-SM-840 (solder mask)
  • IPC-4552 (ENIG)
  • IPC-4555 (OSP)
  • J-STD-003 (solderability)

Selection and Comparison

Key trade-offs when specifying for solder mask and surface finish:

  • ENIG vs. OSP vs. HASL
  • Silkscreen vs. inkjet legend
  • Lead-free vs. leaded HASL

Recommended Equipment from acfindustry.com

The following machines from our catalog support the processes discussed above:

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Frequently Asked Questions

What is Solder Mask and Surface Finish?

Liquid photoimageable solder mask is coated, exposed, developed and thermally cured; legend (silkscreen or inkjet) adds markings. The final finish—HASL, lead-free HASL, ENIG, OSP, immersion tin or silver—protects exposed pads.

What equipment is used for solder mask and surface finish?

It involves Solder Mask and Printing Equipment and Surface Finishing Equipment. You can browse each category and request a matched configuration through the equipment finder.

Where does solder mask and surface finish fit in the PCB process?

Solder mask and finish are among the last fabrication steps before profiling, electrical test and shipment.

What should I consider for solder mask and surface finish?

ENIG offers a flat, durable finish for fine-pitch; OSP is low-cost but has a shorter shelf life; HASL is robust but less flat.

Which standards apply to solder mask and surface finish?

Relevant standards include IPC-SM-840 (solder mask), IPC-4552 (ENIG), IPC-4555 (OSP), and J-STD-003 (solderability).

How do I get a quotation for solder mask and surface finish equipment?

Use the equipment finder on this page to specify your process stage, board type, automation level and production volume, then submit the inquiry. An engineer from acfindustry.com will respond within one business day.