Metal-core PCBs move heat away from high-power LEDs and modules. The aluminum or copper base changes cutting, drilling and surface preparation.
Overview
Below we cover how led and metal-core pcb manufacturing works, where it sits in the process flow, the standards that apply, and the equipment that performs it. Aluminum-backed boards need robust shearing, drilling and routing of the metal base plus dielectric-aware processing, with finishes chosen for thermal cycling.
Where It Fits in the Process
The metal base most affects material preparation and profiling.
Equipment Categories Involved
Key Considerations
Tooling wear and burr control on metal substrates; dielectric thickness controls thermal performance.
Standards and Compliance
Designs and processes in this area commonly reference:
- IPC-6012
- IPC thermal management guidance
- IPC-A-600
Selection and Comparison
Key trade-offs when specifying for led and metal-core pcb manufacturing:
- Aluminum vs. copper core
- Routing vs. punching the metal base
- OSP vs. ENIG for LED boards
Recommended Equipment from acfindustry.com
The following machines from our catalog support the processes discussed above:
Automatic Cutting and Edge Grinding Machine
- Model: ACF-MP-01
- Sub-process: Copper Clad Laminate Processing
- Automation: Automatic (PC/CNC controlled)
Board Grinding and Scrubbing Machine
- Model: ACF-MP-03
- Sub-process: Surface Preparation
- Automation: Semi-automatic
CAM-10 Grinding Machine
- Model: ACF-MP-02
- Sub-process: Surface Preparation
- Automation: Semi-automatic
Chemical Cleaning Machine
- Model: ACF-MP-05
- Sub-process: Surface Preparation
- Automation: Semi-automatic
CNC Forming Machine
- Model: ACF-PR-02
- Sub-process: Routing
- Automation: Automatic (PC/CNC controlled)
CNC Routing Machine (Single Spindle)
- Model: ACF-PR-01
- Sub-process: Routing
- Automation: Automatic (PC/CNC controlled)
Related Topics
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