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PCB Applications

Equipment for Flexible and Rigid-Flex PCB Manufacturing

Flexible and rigid-flex boards use polyimide films and adhesives that handle differently from rigid FR-4, affecting lamination, imaging and profiling.

Overview

Understanding flex and rigid-flex pcb manufacturing means understanding both the process chemistry/mechanics and the machines that control it. Here is what matters. Thin flexible cores require careful handling through lamination and imaging, coverlay application instead of solder mask in flex areas, and laser or die profiling rather than routing in delicate zones.

Where It Fits in the Process

Material handling and lamination dominate flex processing; profiling must avoid delamination.

Equipment Categories Involved

Key Considerations

Dimensional stability of the film and bond between rigid and flex sections are the main yield risks.

Standards and Compliance

Designs and processes in this area commonly reference:

  • IPC-6013 (flex)
  • IPC-2223 (flex design)
  • IPC-A-600

Selection and Comparison

Key trade-offs when specifying for flex and rigid-flex pcb manufacturing:

  • Coverlay vs. solder mask
  • Laser vs. die-cut profiling
  • Adhesive vs. adhesiveless laminate

Recommended Equipment from acfindustry.com

The following machines from our catalog support the processes discussed above:

Related Topics

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Frequently Asked Questions

What is Flex and Rigid-Flex PCB Manufacturing?

Thin flexible cores require careful handling through lamination and imaging, coverlay application instead of solder mask in flex areas, and laser or die profiling rather than routing in delicate zones.

What equipment is used for flex and rigid-flex pcb manufacturing?

It involves Lamination and Multilayer PCB Equipment, Imaging and Photo Process Equipment, and PCB Profiling and Routing Equipment. You can browse each category and request a matched configuration through the equipment finder.

Where does flex and rigid-flex pcb manufacturing fit in the PCB process?

Material handling and lamination dominate flex processing; profiling must avoid delamination.

What should I consider for flex and rigid-flex pcb manufacturing?

Dimensional stability of the film and bond between rigid and flex sections are the main yield risks.

Which standards apply to flex and rigid-flex pcb manufacturing?

Relevant standards include IPC-6013 (flex), IPC-2223 (flex design), and IPC-A-600.

How do I get a quotation for flex and rigid-flex pcb manufacturing equipment?

Use the equipment finder on this page to specify your process stage, board type, automation level and production volume, then submit the inquiry. An engineer from acfindustry.com will respond within one business day.