Heavy copper boards (for power electronics) carry high current in thick copper layers, which changes the demands on etching, plating and lamination.
Overview
This guide explains the role of heavy copper pcb manufacturing in PCB manufacturing, the equipment involved, and how to specify it correctly. Copper weights from 3 oz to over 20 oz require longer etch times with strong sidewall control, high-throw plating and lamination that fills the deep copper topography.
Where It Fits in the Process
Heavy copper stresses etching and lamination most, with plating building thick barrels.
Equipment Categories Involved
Key Considerations
Etch compensation and step plating manage the thick-copper geometry; resin fill in lamination prevents voids.
Standards and Compliance
Designs and processes in this area commonly reference:
- IPC-6012
- IPC-2152 (current capacity)
- IPC-A-600
Selection and Comparison
Key trade-offs when specifying for heavy copper pcb manufacturing:
- Standard vs. heavy-copper etching
- Step plating vs. single plate
- Resin-fill lamination strategies
Recommended Equipment from acfindustry.com
The following machines from our catalog support the processes discussed above:
DES Line (Inner Layer)
- Model: ACF-ET-01
- Sub-process: Chemical Etching
- Automation: Inline / automatic
DES Line (Outer Layer)
- Model: ACF-ET-02
- Sub-process: Chemical Etching
- Automation: Inline / automatic
Hot and Cold Lamination Press (One Set Each)
- Model: ACF-LM-05
- Sub-process: Lamination Systems
- Automation: Inline / automatic
Inner Layer Fusion (Lay-up) Machine
- Model: ACF-LM-04
- Sub-process: Lamination Systems
- Automation: Semi-automatic
Polished Lamination Steel Plates
- Model: ACF-LM-06
- Sub-process: Lamination Systems
- Automation: Semi-automatic
Vertical Continuous Plating (VCP) Line, 20 Cells
- Model: ACF-PL-02
- Sub-process: Electroplating
- Automation: Inline / automatic
Related Topics
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