The Board Flattening (Anti-Warp) Machine (ACF-PR-06) is industrial PCB manufacturing equipment used in the mechanical separation step of pcb profiling and routing equipment. It is engineered for repeatable, production-grade results in printed-circuit-board fabrication.
Board Flattening (Anti-Warp) Machine (ACF-PR-06)
Where the Board Flattening (Anti-Warp) Machine Fits in PCB Manufacturing
In a PCB production line, the Board Flattening (Anti-Warp) Machine operates in the mechanical separation area of pcb profiling and routing equipment. Correct integration with the upstream and downstream stages is essential to overall yield, cycle time and cost per panel.
Supplied as semi-automatic, with options for line integration.
Stainless-steel wetted parts and chemically resistant construction where the process requires it.
Safety interlocks, alarms and guarding designed for a production environment.
Designed for low maintenance, fast changeover and high equipment uptime.
CNC routing with vacuum hold-down for burr-free edges.
Typical Applications
Used to profile, route and depanel boards prior to electrical test and shipment.
Integration and Configuration
The Board Flattening (Anti-Warp) Machine can be supplied as a standalone unit or integrated into a conveyorized, automated line. Panel-size handling, control software, throughput and material compatibility are configured to match your production mix. Because this is a configured-to-order system, the specification is finalized with our engineers before quotation.
Pricing
The Board Flattening (Anti-Warp) Machine is a non-standard, configured-to-order system. Pricing starts from approximately US$18,000 for a base configuration and is finalized by quotation based on your panel size, automation level and throughput requirements.
Request a Quotation for the Board Flattening (Anti-Warp) Machine
Tell us your requirements for the Board Flattening (Anti-Warp) Machine (ACF-PR-06) and our engineers will respond within one business day with a tailored configuration and price.
Frequently Asked Questions
What is the Board Flattening (Anti-Warp) Machine used for?
The Board Flattening (Anti-Warp) Machine is used in the pcb profiling and routing equipment stage of PCB manufacturing, specifically for mechanical separation. It is designed for consistent, production-grade results.
Which board types does the Board Flattening (Anti-Warp) Machine support?
It supports Rigid, multilayer, HDI (flex / rigid-flex optional). The exact configuration can be tailored to your product mix.
Is the Board Flattening (Anti-Warp) Machine automated?
It is supplied as semi-automatic. It can be operated standalone or integrated into a conveyorized line with upstream and downstream handling.
What throughput can the Board Flattening (Anti-Warp) Machine achieve?
Typical throughput is 30-60 panels/hour, depending on panel size, recipe and board complexity.
How is the Board Flattening (Anti-Warp) Machine controlled?
The Board Flattening (Anti-Warp) Machine uses a plc + hmi touchscreen for recipe management, process monitoring and data logging.
How do I request a quotation for the Board Flattening (Anti-Warp) Machine?
Use the equipment finder on this page to confirm your process stage, board type and throughput, then submit the inquiry form. An engineer from acfindustry.com will respond within one business day.
Accessories & Consumables
Compatible consumables and spare parts commonly supplied with pcb profiling and routing equipment. Contact us to add any of these to your equipment quotation.
