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Lamination and Multilayer PCB Equipment · Inner Layer Processing

Pinning Machine — ACF-LM-02

Pinning Machine equipment for inner layer processing. Semi-automatic, 30-60 panels/hour.

Pinning Machine specifications
ModelACF-LM-02
Process categoryLamination and Multilayer PCB Equipment
Sub-processInner Layer Processing
Board typesRigid, multilayer, HDI (flex / rigid-flex optional)
Automation levelSemi-automatic
Control systemPLC + HMI touchscreen
Throughput30-60 panels/hour
Precision / resolutionLine/space down to 20-30 µm; registration ±15 µm
Power supply3-phase 380-415 V AC, 50/60 Hz

Used for inner layer processing, the Pinning Machine (ACF-LM-02) is lamination and multilayer pcb equipment equipment from acfindustry.com. It is configured to deliver consistent quality across rigid, multilayer and HDI boards.

Pinning Machine
Pinning Machine (ACF-LM-02)

Where the Pinning Machine Fits in PCB Manufacturing

In a PCB production line, the Pinning Machine operates in the inner layer processing area of lamination and multilayer pcb equipment. Correct integration with the upstream and downstream stages is essential to overall yield, cycle time and cost per panel.

Key Specifications

Model ACF-LM-02
Board types supported Rigid, multilayer, HDI (flex / rigid-flex optional)
Automation level Semi-automatic
Control system PLC + HMI touchscreen
Throughput 30-60 panels/hour
Power supply 3-phase 380-415 V AC, 50/60 Hz

Features and Capabilities

  • Designed for low maintenance, fast changeover and high equipment uptime.
  • Programmable temperature and pressure profiles for void-free lamination.
  • Vacuum lamination for resin flow control on multilayer stacks.
  • Registration systems to hold inner-layer alignment.
  • Recipe management and process logging via the plc + hmi touchscreen.

Typical Applications

Used to bond inner layers into multilayer and HDI stacks for telecom, computing and automotive boards.

Integration and Configuration

The Pinning Machine can be supplied as a standalone unit or integrated into a conveyorized, automated line. Panel-size handling, control software, throughput and material compatibility are configured to match your production mix. Because this is a configured-to-order system, the specification is finalized with our engineers before quotation.

Pricing

The Pinning Machine is a non-standard, configured-to-order system. Pricing starts from approximately US$52,000 for a base configuration and is finalized by quotation based on your panel size, automation level and throughput requirements.

Request a Quotation for the Pinning Machine

Tell us your requirements for the Pinning Machine (ACF-LM-02) and our engineers will respond within one business day with a tailored configuration and price.

Submit Your Inquiry

Requirements
Business Information

Frequently Asked Questions

What is the Pinning Machine used for?

The Pinning Machine is used in the lamination and multilayer pcb equipment stage of PCB manufacturing, specifically for inner layer processing. It is designed for consistent, production-grade results.

Which board types does the Pinning Machine support?

It supports Rigid, multilayer, HDI (flex / rigid-flex optional). The exact configuration can be tailored to your product mix.

Is the Pinning Machine automated?

It is supplied as semi-automatic. It can be operated standalone or integrated into a conveyorized line with upstream and downstream handling.

What throughput can the Pinning Machine achieve?

Typical throughput is 30-60 panels/hour, depending on panel size, recipe and board complexity.

How is the Pinning Machine controlled?

The Pinning Machine uses a plc + hmi touchscreen for recipe management, process monitoring and data logging.

How do I request a quotation for the Pinning Machine?

Use the equipment finder on this page to confirm your process stage, board type and throughput, then submit the inquiry form. An engineer from acfindustry.com will respond within one business day.

Accessories & Consumables

Compatible consumables and spare parts commonly supplied with lamination and multilayer pcb equipment. Contact us to add any of these to your equipment quotation.

Prepreg and Release Film

Bonding prepreg and release films for lamination.

Lamination Kraft Paper and Pads

Cushion pads and kraft paper for press cycles.