The Inner Layer Fusion (Lay-up) Machine (ACF-LM-04) is a machine used during lamination systems, part of the lamination and multilayer pcb equipment stage of PCB manufacturing. It balances precision, uptime and ease of maintenance for high-mix production.
Inner Layer Fusion (Lay-up) Machine (ACF-LM-04)
Where the Inner Layer Fusion (Lay-up) Machine Fits in PCB Manufacturing
In a PCB production line, the Inner Layer Fusion (Lay-up) Machine operates in the lamination systems area of lamination and multilayer pcb equipment. Correct integration with the upstream and downstream stages is essential to overall yield, cycle time and cost per panel.
Registration systems to hold inner-layer alignment.
Recipe management and process logging via the plc + hmi touchscreen.
Supplied as semi-automatic, with options for line integration.
Stainless-steel wetted parts and chemically resistant construction where the process requires it.
Safety interlocks, alarms and guarding designed for a production environment.
Typical Applications
Used to bond inner layers into multilayer and HDI stacks for telecom, computing and automotive boards.
Integration and Configuration
The Inner Layer Fusion (Lay-up) Machine can be supplied as a standalone unit or integrated into a conveyorized, automated line. Panel-size handling, control software, throughput and material compatibility are configured to match your production mix. Because this is a configured-to-order system, the specification is finalized with our engineers before quotation.
Pricing
The Inner Layer Fusion (Lay-up) Machine is a non-standard, configured-to-order system. Pricing starts from approximately US$52,000 for a base configuration and is finalized by quotation based on your panel size, automation level and throughput requirements.
Request a Quotation for the Inner Layer Fusion (Lay-up) Machine
Tell us your requirements for the Inner Layer Fusion (Lay-up) Machine (ACF-LM-04) and our engineers will respond within one business day with a tailored configuration and price.
Frequently Asked Questions
What is the Inner Layer Fusion (Lay-up) Machine used for?
The Inner Layer Fusion (Lay-up) Machine is used in the lamination and multilayer pcb equipment stage of PCB manufacturing, specifically for lamination systems. It is designed for consistent, production-grade results.
Which board types does the Inner Layer Fusion (Lay-up) Machine support?
It supports Rigid, multilayer, HDI (flex / rigid-flex optional). The exact configuration can be tailored to your product mix.
Is the Inner Layer Fusion (Lay-up) Machine automated?
It is supplied as semi-automatic. It can be operated standalone or integrated into a conveyorized line with upstream and downstream handling.
What throughput can the Inner Layer Fusion (Lay-up) Machine achieve?
Typical throughput is 30-60 panels/hour, depending on panel size, recipe and board complexity.
How is the Inner Layer Fusion (Lay-up) Machine controlled?
The Inner Layer Fusion (Lay-up) Machine uses a plc + hmi touchscreen for recipe management, process monitoring and data logging.
How do I request a quotation for the Inner Layer Fusion (Lay-up) Machine?
Use the equipment finder on this page to confirm your process stage, board type and throughput, then submit the inquiry form. An engineer from acfindustry.com will respond within one business day.
Accessories & Consumables
Compatible consumables and spare parts commonly supplied with lamination and multilayer pcb equipment. Contact us to add any of these to your equipment quotation.
