Used for electroless copper, the Black Hole Direct Metallization Line (ACF-PL-01) is plating and metallization equipment equipment from acfindustry.com. It is configured to deliver consistent quality across rigid, multilayer and HDI boards.
Black Hole Direct Metallization Line (ACF-PL-01)
Where the Black Hole Direct Metallization Line Fits in PCB Manufacturing
In a PCB production line, the Black Hole Direct Metallization Line operates in the electroless copper area of plating and metallization equipment. Correct integration with the upstream and downstream stages is essential to overall yield, cycle time and cost per panel.
Recipe management and process logging via the plc + hmi touchscreen.
Supplied as inline / automatic, with options for line integration.
Stainless-steel wetted parts and chemically resistant construction where the process requires it.
Safety interlocks, alarms and guarding designed for a production environment.
Designed for low maintenance, fast changeover and high equipment uptime.
Typical Applications
Used to metallize holes and build copper for multilayer, HDI and heavy-copper boards.
Integration and Configuration
The Black Hole Direct Metallization Line can be supplied as a standalone unit or integrated into a conveyorized, automated line. Panel-size handling, control software, throughput and material compatibility are configured to match your production mix. Because this is a configured-to-order system, the specification is finalized with our engineers before quotation.
Pricing
The Black Hole Direct Metallization Line is a non-standard, configured-to-order system. Pricing starts from approximately US$38,000 for a base configuration and is finalized by quotation based on your panel size, automation level and throughput requirements.
Request a Quotation for the Black Hole Direct Metallization Line
Tell us your requirements for the Black Hole Direct Metallization Line (ACF-PL-01) and our engineers will respond within one business day with a tailored configuration and price.
Frequently Asked Questions
What is the Black Hole Direct Metallization Line used for?
The Black Hole Direct Metallization Line is used in the plating and metallization equipment stage of PCB manufacturing, specifically for electroless copper. It is designed for consistent, production-grade results.
Which board types does the Black Hole Direct Metallization Line support?
It supports Rigid, multilayer, HDI (flex / rigid-flex optional). The exact configuration can be tailored to your product mix.
What is the maximum panel size for the Black Hole Direct Metallization Line?
The standard maximum panel size is 610 x 610 mm. Larger or custom panel handling can be quoted on request.
Is the Black Hole Direct Metallization Line automated?
It is supplied as inline / automatic. It can be operated standalone or integrated into a conveyorized line with upstream and downstream handling.
What throughput can the Black Hole Direct Metallization Line achieve?
Typical throughput is Up to 90 panels/hour, depending on panel size, recipe and board complexity.
How is the Black Hole Direct Metallization Line controlled?
The Black Hole Direct Metallization Line uses a plc + hmi touchscreen for recipe management, process monitoring and data logging.
How do I request a quotation for the Black Hole Direct Metallization Line?
Use the equipment finder on this page to confirm your process stage, board type and throughput, then submit the inquiry form. An engineer from acfindustry.com will respond within one business day.
Accessories & Consumables
Compatible consumables and spare parts commonly supplied with plating and metallization equipment. Contact us to add any of these to your equipment quotation.
Phosphorized Copper Anodes / Balls
Copper anode material for electroplating cells.
Plating Brighteners and Additives
Bath additives for throwing power and surface quality.
