Used for surface activation, the Pre-Plating Treatment Line (ACF-PL-03) is plating and metallization equipment equipment from acfindustry.com. It is configured to deliver consistent quality across rigid, multilayer and HDI boards.
Pre-Plating Treatment Line (ACF-PL-03)
Where the Pre-Plating Treatment Line Fits in PCB Manufacturing
In a PCB production line, the Pre-Plating Treatment Line operates in the surface activation area of plating and metallization equipment. Correct integration with the upstream and downstream stages is essential to overall yield, cycle time and cost per panel.
Designed for low maintenance, fast changeover and high equipment uptime.
Uniform current distribution for consistent copper thickness and throwing power.
Filtration and dosing systems to keep bath chemistry within specification.
Programmable plating cycles for panel and pattern plating.
Recipe management and process logging via the plc + hmi touchscreen.
Typical Applications
Used to metallize holes and build copper for multilayer, HDI and heavy-copper boards.
Integration and Configuration
The Pre-Plating Treatment Line can be supplied as a standalone unit or integrated into a conveyorized, automated line. Panel-size handling, control software, throughput and material compatibility are configured to match your production mix. Because this is a configured-to-order system, the specification is finalized with our engineers before quotation.
Pricing
The Pre-Plating Treatment Line is a non-standard, configured-to-order system. Pricing starts from approximately US$38,000 for a base configuration and is finalized by quotation based on your panel size, automation level and throughput requirements.
Request a Quotation for the Pre-Plating Treatment Line
Tell us your requirements for the Pre-Plating Treatment Line (ACF-PL-03) and our engineers will respond within one business day with a tailored configuration and price.
Frequently Asked Questions
What is the Pre-Plating Treatment Line used for?
The Pre-Plating Treatment Line is used in the plating and metallization equipment stage of PCB manufacturing, specifically for surface activation. It is designed for consistent, production-grade results.
Which board types does the Pre-Plating Treatment Line support?
It supports Rigid, multilayer, HDI (flex / rigid-flex optional). The exact configuration can be tailored to your product mix.
What is the maximum panel size for the Pre-Plating Treatment Line?
The standard maximum panel size is 610 x 610 mm. Larger or custom panel handling can be quoted on request.
Is the Pre-Plating Treatment Line automated?
It is supplied as inline / automatic. It can be operated standalone or integrated into a conveyorized line with upstream and downstream handling.
What throughput can the Pre-Plating Treatment Line achieve?
Typical throughput is Up to 90 panels/hour, depending on panel size, recipe and board complexity.
How is the Pre-Plating Treatment Line controlled?
The Pre-Plating Treatment Line uses a plc + hmi touchscreen for recipe management, process monitoring and data logging.
How do I request a quotation for the Pre-Plating Treatment Line?
Use the equipment finder on this page to confirm your process stage, board type and throughput, then submit the inquiry form. An engineer from acfindustry.com will respond within one business day.
Accessories & Consumables
Compatible consumables and spare parts commonly supplied with plating and metallization equipment. Contact us to add any of these to your equipment quotation.
Phosphorized Copper Anodes / Balls
Copper anode material for electroplating cells.
Plating Brighteners and Additives
Bath additives for throwing power and surface quality.
